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Module DEVICE PHYSICS

Module code: EP409
Credits: 5
Semester: 2
Department: EXPERIMENTAL PHYSICS
International: Yes
Coordinator: Dr Dan Nickström (EXPERIMENTAL PHYSICS)
Overview Overview
 

The aim of this module is to provide a comprehensive overview of semiconductor physics, semiconductor manufacturing techniques and a variety of semiconductor devices.

Module Content

Semiconductor Manufacturing: Taking raw materials and transforming them into high purity silicon wafers (purification and single crystal formation).

Device Manufacture: photolithography, epitaxial growth, etching techniques, doping, plasma processes and metal deposition.

Revision of semiconductor physics: intrinsic and extrinsic semiconductors, continuity equations, electron transport, Haynes-Shockley experiment.

Integrated circuits: processes of IC production, large scale integration, types of ICs, technology families, future challenges.

Junctions: p-n junction, forward and reverse bias, metal-semiconductor junction, insulator-semiconductor junction, the MOS capacitor, bipolar junction transistors and field effect transistors.

Opto-electronics: physics and operation of LEDs, solar cells, photodiodes, diode lasers, OLEDs, fibre optics, semiconductor optics and applications.

Imaging devices: CCDs and CMOS devices and CCD readout.

Open Learning Outcomes
 
Open Teaching & Learning methods
 
Open Assessment
 
Open Repeat options
 
Open Pre-Requisites
 
Open Timetable
 
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